Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12324105 | Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package | Chihiro Hayashi, Takao Tanigawa, Ryuji Akebi, Naoyoshi Sato, Akira Horie | 2025-06-03 |