Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341088 | Wiring board and semiconductor device each having non-photosensitive thermosetting encapsulating layer over photosensitive resin layer of interconnect structure | Hiroshi Taneda, Rie Mizutani, Masaya Takizawa, Yoshiki Akiyama | 2025-06-24 |