Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12378386 | Resin composition and application thereof | Naidong SHE, Qianfa Liu, Zengbiao Huang, Songgang Chai, Yanhua Zhang | 2025-08-05 |
| 12234318 | Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition | Yong Chen, Guofang TANG | 2025-02-25 |