Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414422 | Chip-scale package light emitting diode | Se Hee Oh, Jong Kyu Kim | 2025-09-09 |
| 12292335 | Window for far-infrared thermal imaging sensor assembly and a far-infrared thermal image sensor assembly comprising same | — | 2025-05-06 |