Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12427446 | Liquid supplying unit and liquid supplying method | Jung Suk GOH, Kuk Saeng KIM, Wan Hee JEONG | 2025-09-30 |
| 12390842 | Supporting structure, apparatus for supporting substrate and facility for processing substrate | Jae Hun JEONG, Cheol Shin, Wan Hee JEONG | 2025-08-19 |
| 12334381 | Guide unit, transfer assembly and die bonding apparatus including the same | Yeon Hyuk Jung, Eung Seok Kim, Byoung Ho Jung | 2025-06-17 |
| 12322614 | Wafer expander for uniformly expanding gap between dies, and die supplying module and die bonding equipment including same | Kuk Saeng KIM, Wan Hee JEONG | 2025-06-03 |
| 12227373 | Article transport vehicle, rail assembly, and article transport system including the same | Wan Hee JEONG, Kuk Saeng KIM, Noh Hoon Myoung | 2025-02-18 |