Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408301 | Thermal module and joining method for hermetically sealed enclosure of a thermal module using a capillary joint | Chetan Harsha Edara, Pavan Kumar Varma Buddaraju | 2025-09-02 |