Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347733 | Die separation ring for wafers having a large die aspect ratio | Shuo Li, Xiangyang Liu, Xiaodong Liu, Weiting Jiang, Zhenghao Wu +1 more | 2025-07-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347733 | Die separation ring for wafers having a large die aspect ratio | Shuo Li, Xiangyang Liu, Xiaodong Liu, Weiting Jiang, Zhenghao Wu +1 more | 2025-07-01 |