Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224248 | Semiconductor wafer and semiconductor dies formed therefrom including grooves along long edges of the semiconductor dies | Jia-Xsing Li, Dongpeng Xue, Huirong Zhang, Guocheng Zhong, Xiaohui Wang +1 more | 2025-02-11 |