Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347795 | Semiconductor package including uneven structures and electronic device including the same | Bonggyu Kang, Yongha Kim, Heesu Kim, Kwangsoo Park, Junsik Park | 2025-07-01 |
| 12283576 | Electronic device including thermal interface material layer and semiconductor package | Yongha Kim, Bonggyu Kang | 2025-04-22 |