Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376229 | Resin coated copper and circuit board including the same | Jeong Han Kim, Moo Seong Kim | 2025-07-29 |
| 12256489 | Circuit board including a buffer layer for improving | Jeong Han Kim, Moo Seong Kim | 2025-03-18 |
| 12232255 | Circuit board | Jeong Han Kim | 2025-02-18 |
| 12219700 | Circuit board | Dong Hwa LEE | 2025-02-04 |
| 12207404 | Circuit board | Dong Hwa LEE | 2025-01-21 |