Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362253 | Semiconductor package and method of fabricating the same | Hyeonjeong Hwang, Dongkyu Kim, Minjung Kim | 2025-07-15 |
| 12327824 | Semiconductor package including redistribution substrate | Dongkyu Kim, Daeho Lee, Seokhyun Lee, Minjung Kim | 2025-06-10 |
| 12191236 | Semiconductor package | Hyeonjeong Hwang, Minjung Kim, Dongkyu Kim | 2025-01-07 |