Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191246 | Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal | Jae-Min Jung, Jeong-Kyu Ha, Sang-Uk Han | 2025-01-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191246 | Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal | Jae-Min Jung, Jeong-Kyu Ha, Sang-Uk Han | 2025-01-07 |