Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12370632 | Metal particle for adhesive paste, method of preparing the same, solder paste including the same, composite bonding structure formed therefrom, and semiconductor device including the composite bonding structure | Junghoon Lee | 2025-07-29 |
| 12288765 | Hybrid bonding structures, semiconductor devices having the same, and methods of manufacturing the semiconductor devices | Byonggwon Song, Junghoon Lee | 2025-04-29 |