Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374667 | Semiconductor package and method of manufacturing the same | Byungmin Yu, Junghyun Lee | 2025-07-29 |
| 12341118 | Semiconductor package including an encapsulant | Seungwan Shin, Gun Lee | 2025-06-24 |
| 12230580 | Method of manufacturing semiconductor package, and semiconductor package | — | 2025-02-18 |