Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417972 | Semiconductor package | — | 2025-09-16 |
| 12394753 | Semiconductor package | Hyeonseok LEE, Seokhyun Lee | 2025-08-19 |
| 12300625 | Semiconductor package including outer conductive plate | Minjung Kim, Dongkyu Kim, Seokhyun Lee, Jaegwon Jang | 2025-05-13 |
| 12293989 | Semiconductor package | Minjung Kim, Dongkyu Kim, Seokhyun Lee | 2025-05-06 |
| 12243813 | Connection structure and method of forming the same | — | 2025-03-04 |
| 12230556 | Semiconductor package and method of fabricating the same | Minjun Bae, Hyeonseok LEE, Gwangjae Jeon | 2025-02-18 |
| 12211777 | Semiconductor package including a dummy pattern | Minjung Kim, Dongkyu Kim, Hyeonjeong Hwang | 2025-01-28 |
| 12205914 | Semiconductor package | Inhyung SONG, Seokhyun Lee | 2025-01-21 |