JP

Jiyong Park

Samsung: 1 patents #6,142 of 15,164Top 45%
Overall (2025): #343,229 of 469,880Top 75%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12272661 Semiconductor package including semiconductor chips stacked via conductive bumps Eunsu LEE, Dongho Kim, Jeonghyun Lee 2025-04-08