Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388029 | Semiconductor package | Choongbin Yim, Jongbo Shim, Jinwoo Park | 2025-08-12 |
| 12334454 | Semiconductor package including molding layer | Dongho Kim | 2025-06-17 |
| 12261157 | Semiconductor device having package on package structure and method of manufacturing the semiconductor device | Jeonghyun Lee, Jongbo Shim | 2025-03-25 |