Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315818 | Interconnection structure of a semiconductor chip having pads of different widths and semiconductor package including the interconnection structure | Keumhee Ma | 2025-05-27 |
| 12224258 | Semiconductor chip and semiconductor package including the same | Wonkyun Kwon | 2025-02-11 |