Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404170 | Method for producing a bonding pad for a micromechanical sensor element | Christof Schwenk, Frank Reichenbach, Friedjof Heuck, Heiko Stahl, Nicolas Schorr | 2025-09-02 |