Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12305036 | Epoxy resin composition for semiconductor encapsulation and semiconductor device | Shoichi Osada, Hiroki Oishi, Norifumi Kawamura, Ryuhei Yokota, Masahiro KANETA | 2025-05-20 |