Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362186 | Pip structure and manufacturing methods of high voltage device and capacitor device having PIP structure | Chin-Chin Tsai | 2025-07-15 |
| 12300565 | Chip package unit and chip packaging method | Hao-Lin Yen, Heng-Chi Huang | 2025-05-13 |
| 12272592 | High voltage device and manufacturing method thereof | Kun-Huang Yu, Chien-Yu Chen, Ting-Wei Liao, Chih-Wen Hsiung, Chun-Lung Chang +4 more | 2025-04-08 |