MH

Manuel Hofer

RP Rf360 Singapore Pte.: 3 patents #4 of 60Top 7%
QU Qualcomm: 1 patents #943 of 2,239Top 45%
Overall (2025): #32,744 of 469,880Top 7%
4
Patents 2025

Issued Patents 2025

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
12341488 Package comprising an acoustic device and a polymer cap layer Sebastian Brunner, Changhan Hobie Yun, Stefan Leopold Hatzl, Horst Droescher, Christian Hoffmann 2025-06-24
12334909 Multi-level stacked acoustic wave (AW) filter packages and related fabrication methods Xavier Perois, Michael Wick, Jeroen Bielen, Stefan Leopold Hatzl, Juergen Portmann 2025-06-17
12316304 Vertically coupled SAW resonators Stefan Ammann, Matthias PERNPEINTNER, Stefan Leopold Hatzl 2025-05-27
12261583 Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods Simone Colasanti, Nadine Erhard-Egeler, Stefan Leopold Hatzl, Peter Kirchhofer, Volker Schulz 2025-03-25