Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12195566 | Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device | Takahito Sekido, Masashi Okaniwa, Genki Sugiyama, Kentaro Takano | 2025-01-14 |