Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12398704 | Thermally-enhanced and deployable structures | Tuan L. Duong, Adam D. Leeds, Joseph A. Boswell, Daniel A. Pounds | 2025-08-26 |
| 12266629 | Ball bond impedance matching | Patrick E. Boyle, Erika Klek, Mikhail Pevzner | 2025-04-01 |