Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12325088 | Head assembly for mounting conductive ball | Youn Sung Ko, Yoshiaki Yukimori | 2025-06-10 |
| 12237295 | Flip chip laser bonding system | — | 2025-02-25 |
| 12237296 | System for laser bonding of flip chip | Youn Sung Ko | 2025-02-25 |