Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12310146 | Methods for die-to-wafer device layer transfer with precise control of device layer vertical position | Lei Zhang, Fang Ou, Lina He, Paul S. Drzaic, Dmitry S. Sizov +4 more | 2025-05-20 |