Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12298825 | Thermal environment evaluation and compensation for computer components | Qi Lin, Chad Plummer, Hans Wolfgang Schulze, Darryl Moore | 2025-05-13 |
| 12219691 | Printed circuit board assembly with integrated vapor chamber | James Stephen Fields, Jr., Seungkug Park | 2025-02-04 |