Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368324 | Inductive coupling system and method for adaptive control of power transfer for wireless three-dimensional stacked chip package | Xiaolei Zhu, Rushuo Tao, Chonghui Sun, Kun Yang | 2025-07-22 |
| 12278138 | Method of manufacturing memory device with first and second isolation members using patterned photoresist layer and energy-decomposable mask | — | 2025-04-15 |
| 12243850 | Devices, systems, and methods for stacked die packages | Dongkai Shangguan | 2025-03-04 |
| 12237209 | Method of manufacturing memory device having active area in elongated block | — | 2025-02-25 |