Issued Patents 2025
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412794 | Module having a changing filler content rate in sealing resin layer | Toru Komatsu | 2025-09-09 |
| 12402289 | Module with reduced parasite capacitance | Ryohei OKABE | 2025-08-26 |
| 12363821 | Circuit module | Ryota Sato, Motohiko KUSUNOKI | 2025-07-15 |
| 12356538 | Electronic component module | Ryohei OKABE | 2025-07-08 |
| 12328857 | Electronic component module and method of manufacturing electronic component module | Toru Komatsu, Motohiko KUSUNOKI | 2025-06-10 |
| 12309932 | Electronic component module, sub-module, and method for manufacturing same | Tsuyoshi Takakura, Yoshihito Otsubo, Hideo Nakagoshi | 2025-05-20 |
| 12309913 | Module | Yoshihito Otsubo, Ryoichi Kita | 2025-05-20 |
| 12300628 | Module and method for manufacturing same | Toru Komatsu, Yukiya YAMAGUCHI | 2025-05-13 |
| 12267964 | Electronic component module and method for manufacturing electronic component module | Toru Komatsu | 2025-04-01 |
| 12255224 | Electronic component module | Takafumi Kusuyama, Tsuyoshi Takakura | 2025-03-18 |
| 12243858 | Electronic component module, and method of manufacturing electronic component module | Toru Komatsu | 2025-03-04 |
| 12245363 | Electronic component module, and method of manufacturing the same | — | 2025-03-04 |
| 12237271 | Module and method of manufacturing the same | Toru Komatsu | 2025-02-25 |
| 12224249 | Package module comprising marking and shield films and method of manufacturing the same | Toru Komatsu | 2025-02-11 |
| 12193148 | Module | Yoshihito Otsubo | 2025-01-07 |