Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400921 | Through-interposer grounding using blind vias | Emmanuel LEFEUVRE, Frédéric Voiron | 2025-08-26 |
| 12336293 | Semiconductor structure with selective bottom terminal contacting | Julien El Sabahy, Larry BUFFLE, Frédéric Voiron | 2025-06-17 |
| 12260996 | Electronic device with differential transmission lines equipped with capacitors supported by a base, and corresponding manufacturing method | David Denis, Emmanuel LEFEUVRE | 2025-03-25 |
| 12249600 | Contact structures in RC-network components | Yohei Yamaguchi, Yasuhiro Murase | 2025-03-11 |