Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12365788 | Resin composition, resin composition molded body, and power cable | Takanori Yamazaki, Fumitoshi IYODA | 2025-07-22 |
| 12272745 | Semiconductor device | Hiromitsu Kato, Masahiko Ogura, Toshiharu Makino, Tsubasa Matsumoto, Norio Tokuda +1 more | 2025-04-08 |