Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266630 | Bond pad connection layout | Bharat Bhushan, Pratap Murali, David Daycock | 2025-04-01 |
| 12230608 | Semiconductor assemblies with system and methods for conveying signals using through mold vias | Travis M. Jensen | 2025-02-18 |