Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341110 | Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices | Quang Nguyen, Christopher Glancey, Shams U. Arifeen | 2025-06-24 |
| 12269106 | Two-step solder-mask-defined design | Hyunsuk Chun | 2025-04-08 |
| 12218079 | Semiconductor devices with reinforced substrates | Shams U. Arifeen, Christopher Glancey | 2025-02-04 |
| 12211814 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Chan H. Yoo | 2025-01-28 |
| 12211822 | Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods | Shams U. Arifeen, Christopher Glancey | 2025-01-28 |