Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424502 | Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles | Bomy Chen | 2025-09-23 |
| 12205885 | Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring | Yaojian Leng | 2025-01-21 |
| 12205910 | Integrated circuit bond pad with multi-material toothed structure | Bomy Chen, Yaojian Leng, Gerald Marsico, Julius Kovats | 2025-01-21 |