Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424579 | Integrated chip including an upper conductive structure having multilayer stack to decrease fabrication costs and increase performance | Yao-Wen Chang, Chia-Wen Zhong, Yen-Liang Lin | 2025-09-23 |
| 12369329 | Bottom-electrode interface structure for memory | Chia-Wen Zhong, Yao-Wen Chang | 2025-07-22 |
| 12354633 | Spacer film scheme form polarization improvement | Yao-Wen Chang | 2025-07-08 |