Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12313973 | Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same | Jeong Wook MUN, Woo Jae Jeong, Jee Hyeon Hwang, Eun Byurl CHO, Jeong Hyuk Ahn | 2025-05-27 |