Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12265488 | Apparatus and method for die-to-die (D2D) interconnects | Wangyong Im, Byoungkon Jo, Gyesik Oh, Jangseok Choi | 2025-04-01 |
DK
Duksung Kim
Overall (2025): #400,007 of 469,880Top 90%
1
Patents 2025