Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400412 | Method for modifying design on basis of additive cross-section outline for 3D printing | Hye In Lee, Hwa Seon Shin, Sung Hun Park | 2025-08-26 |
| 12350886 | 3D printing slicing method for solving quantization error problem | Hwa Seon Shin, Hye In Lee, Sung Hun Park, Ji Min Jang | 2025-07-08 |
| 12233601 | Method for creating 2D slicing polyline based support structure for 3D printing | Hwa Seon Shin, Hye In Lee, Sung Hun Park | 2025-02-25 |
| 12220921 | Nozzle clogging defect compensating method for binder jetting stack manufacturing means | Hwa Seon Shin, Sung Hun Park, Hye In Lee, Jin Min Jang | 2025-02-11 |
| 12202206 | 3D printing slicing method for solving tolerance problem | Hwa Seon Shin, Hye In Lee, Sung Hun Park | 2025-01-21 |