Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12385697 | Micropillar-enabled thermal ground plane | Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu +1 more | 2025-08-12 |
| 12188732 | Single and multi-layer mesh structures for enhanced thermal transport | Rongfu Wen, Shanshan Xu, Yung-Cheng Lee | 2025-01-07 |