Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327074 | Simulation apparatus and creation method of thermal equivalent circuit | Daisuke Ando, Hitoshi Imi, Takahiro Aoki | 2025-06-10 |
| 12300682 | Semiconductor package | Jia Liu, Masahiko Hori, Tatsuo Tonedachi | 2025-05-13 |