LP

Luis Ricardo Perez-Corona

IN Intel: 1 patents #1,527 of 3,896Top 40%
📍 Tlaquepaque, MX: #2 of 5 inventorsTop 40%
Overall (2025): #301,245 of 469,880Top 65%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12322685 Integrated circuit (IC) package with substrate having validation connectors Maria Jose Garcia-Garcia de Leon, Ricardo Astro-Bohorquez, Francisco Javier Ramirez-Aldana 2025-06-03