Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368125 | Package with polymer pillars and raised portions | — | 2025-07-22 |
| 12354986 | Wafer level chip scale package having varying thicknesses | — | 2025-07-08 |
| 12266636 | Stacked die package including a multi-contact interconnect | — | 2025-04-01 |
| 12230619 | Low profile sensor packages | — | 2025-02-18 |