Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255076 | Method for manufacturing leadless semiconductor package with wettable flanks | Aaron Cadag, Ela Mia Cadag | 2025-03-18 |
| 12224251 | Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads | — | 2025-02-11 |