Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400982 | Chip package on package structure, packaging method thereof, and electronic device | Xiaodong Zhang, Yong Guan, Simin Wang | 2025-08-26 |
| 12388059 | Chip package structure and chip packaging method | Xiaodong Zhang, Yong Guan, Heng Li | 2025-08-12 |