Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400982 | Chip package on package structure, packaging method thereof, and electronic device | Tonglong Zhang, Xiaodong Zhang, Yong Guan | 2025-08-26 |
SW
Simin Wang
Overall (2025): #212,134 of 469,880Top 50%
1
Patents 2025