KS

Kazuma Sekiya

DI Disco: 7 patents #2 of 133Top 2%
Overall (2025): #12,186 of 469,880Top 3%
7
Patents 2025

Issued Patents 2025

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDate
12424478 Apparatus for and method of processing workpiece 2025-09-23
12374535 Wafer processing apparatus and wafer processing method 2025-07-29
12350788 Dressing member 2025-07-08
12330266 Polishing apparatus with thickness measuring unit Keiji Nomaru 2025-06-17
12304027 Grinding apparatus and use method of grinding apparatus Tomotaka Tabuchi, Yuannan Li 2025-05-20
12217966 Processing method of wafer, protective sheet, and protective sheet laying method 2025-02-04
12211731 Wafer processing method 2025-01-28