Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278205 | Semiconductor device package with improved die pad and solder mask design | Guangxu Li | 2025-04-15 |
| 12266597 | Multilevel package substrate with stair shaped substrate traces | Chun Ping Lo, Yutaka Suzuki | 2025-04-01 |
| 12243835 | Package substrate with CTE matching barrier ring around microvias | Guangxu Li | 2025-03-04 |
| 12199008 | Package heat dissipation including a die attach film | Rongwei Zhang | 2025-01-14 |