HL

Heng Liu

3M: 1 patents #276 of 881Top 35%
IBM: 1 patents #1,197 of 3,866Top 35%
📍 Shanghai, CA: #181 of 457 inventorsTop 40%
Overall (2025): #122,760 of 469,880Top 30%
2
Patents 2025

Issued Patents 2025

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12234395 Pressure-sensitive adhesive composition and pressure-sensitive adhesive tape Weina Wang, Lu Shen, Yunshu Zhang, Yu Che, Panpan Lin +3 more 2025-02-25
12210981 Auto feature preparation for high performance online inferencing Ke Wei Wei, Hong Min, Shuang Yu, Qi Zhang, Meichi M. Lin +1 more 2025-01-28