Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381139 | Electronic device and multilevel package substrate with elevated trace features for solder and/or die confinement and method for fabricating the electronic device | Yiqi Tang, Rajen Manicon Murugan | 2025-08-05 |
| 12278205 | Semiconductor device package with improved die pad and solder mask design | Jaimal Mallory Williamson | 2025-04-15 |
| 12260201 | Application deployment method, application blueprint generation method, platform, terminal and medium | Zhanwei Xu, Xiaowu Zhong | 2025-03-25 |
| 12243835 | Package substrate with CTE matching barrier ring around microvias | Jaimal Mallory Williamson | 2025-03-04 |