DK

Dae-Woo Kim

PC Posco Co.: 3 patents #11 of 209Top 6%
Samsung: 2 patents #3,372 of 15,164Top 25%
IN Intel: 1 patents #1,527 of 3,896Top 40%
📍 Pohang-si, AZ: #1 of 1 inventorsTop 100%
Overall (2025): #17,602 of 469,880Top 4%
6
Patents 2025

Issued Patents 2025

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
12331373 Steel material, for pressure vessel, showing excellent hydrogen-induced cracking resistance and method for preparing same Woo-Yeol Cha 2025-06-17
12261164 Semiconductor package Sang Cheon Park, Taehun Kim, Hyuekjae Lee 2025-03-25
12243812 Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages Sujit Sharan 2025-03-04
12237308 Semiconductor package Hyuekjae Lee, Eunseok Song 2025-02-25
12227826 Steel plate for pressure vessel having excellent hydrogen induced cracking resistance and method of manufacturing same 2025-02-18
12221682 Ultrahigh-strength steel having excellent cold workability and SSC resistance, and manufacturing method therefor Young-Jin Jung 2025-02-11